Quality

We make excellence the standard

Quality Assurance
At TTN, quality management is one of our top priorities. We source products only from trusted suppliers, preventing counterfeit components from entering our supply chain at the earliest stage, and provide testing services for electronic components. All products we sell undergo rigorous testing, and we guarantee quality at every stage of the procurement process.
If you have requirements for electronic component quality inspection, we offer a free testing service with an official professional report. The inspection is carried out in accordance with international standards and certifications, including AS6081, AS6171, and AS9120, ensuring a high level of quality control. Additional laboratory methods may be applied, if necessary, for more in-depth verification.
Electronic Component Testing Services
　
描述
Quality Control Process
描述
  • Upon receipt of electronic components, our quality control experts verify the conformity of packaging, labeling, and the components themselves with the original manufacturer’s specifications, including MPN number, date code, quantity, and overall appearance.
    Visual Inspection
    Upon receipt of electronic components, our quality control experts verify the conformity of packaging, labeling, and the components themselves with the original manufacturer’s specifications, including MPN number, date code, quantity, and overall appearance.
  • One of our key quality control methods is marking verification using acetone and scratch tests. During this procedure, the top layer is removed, allowing us to check the presence of the marking and confirm its compliance with the manufacturer’s specifications.
    Marking Inspection
    One of our key quality control methods is marking verification using acetone and scratch tests. During this procedure, the top layer is removed, allowing us to check the presence of the marking and confirm its compliance with the manufacturer’s specifications.
  • We can perform XRF (X-ray Fluorescence Analysis) to evaluate the material composition of solder joints and plastic housings of electronic components. This method helps to identify restricted substances (e.g., lead), detect differences between batches, and reveal other deviations from original components.
    RoHS Compliance Testing
    We can perform XRF (X-ray Fluorescence Analysis) to evaluate the material composition of solder joints and plastic housings of electronic components. This method helps to identify restricted substances (e.g., lead), detect differences between batches, and reveal other deviations from original components.
  • X-ray inspection and analysis is a non-destructive testing method used to examine wire connections and verify chip dimensions. Our specialized software can compare all X-ray images and highlight any suspicious inconsistencies.
    X-Ray Inspection
    X-ray inspection and analysis is a non-destructive testing method used to examine wire connections and verify chip dimensions. Our specialized software can compare all X-ray images and highlight any suspicious inconsistencies.
  • Using immersion methods and visual inspection, we can verify whether the components are oxidized and determine their suitability for assembly.
    Solderability Testing
    Using immersion methods and visual inspection, we can verify whether the components are oxidized and determine their suitability for assembly.
  • Decapsulation allows us to inspect internal chips, read the markings, and verify their authenticity. During the process, we use a digital microscope with up to 1000x magnification, providing a clear view even of the smallest markings.
    Decapsulation Test
    Decapsulation allows us to inspect internal chips, read the markings, and verify their authenticity. During the process, we use a digital microscope with up to 1000x magnification, providing a clear view even of the smallest markings.
  • In accordance with IPC/JEDEC J-STD-033D, we can subject components to thermal treatment to ensure that all shipped products meet the manufacturer’s MSL level requirements and prevent damage during PCB assembly.
    Temperature Testing
    In accordance with IPC/JEDEC J-STD-033D, we can subject components to thermal treatment to ensure that all shipped products meet the manufacturer’s MSL level requirements and prevent damage during PCB assembly.
To maintain a high level of integrity and trust in every business transaction, we conduct extensive testing in cooperation with independent third-party laboratories. All of our partners are certified in accordance with strict industry standards.
Address

Office 1901-K, Century Hui Plaza,

North Shennan Middle Road, West Zhonghang Road,

Futian District, Shenzhen

Contact Information

Tel.: +86 166 261 88999

E-mail: benny@titaniumelec.com

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